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| NLASB3157 SPDT, 3 W RON Switch The NLASB3157 is an advanced CMOS analog switch fabricated with silicon gate CMOS technology. It achieves very low propagation delay and RDSON resistances while maintaining CMOS low power dissipation. Analog and digital voltages that may vary across the full power-supply range (from VCC to GND). This device is a drop in replacement for the NC7SB3157. The select pin has overvoltage protection that allows voltages above VCC, up to 7.0 V to be present on the pin without damage or disruption of operation of the part, regardless of the operating voltage. Features 6 1 WDFN6 MT SUFFIX CASE 506AS http://onsemi.com MARKING DIAGRAMS * * * * * * * * * * * * * * * High Speed: tPD = 1.0 ns (Typ) at VCC = 5.0 V Low Power Dissipation: ICC = 2.0 mA (Max) at TA = 25C Standard CMOS Logic Levels High Bandwidth, Improved Linearity Switches Standard NTSC/PAL Video, Audio, SPDIF and HDTV May be used for Clock Switching, Data Multiplexing, etc. RON Typical = 3 W @ VCC = 4.5 V Break Before Make Circuitry, Prevents Inadvertent Shorts 2 Devices can Switch Balanced Signal Pairs, e.g. LVDS u 200-Mb/s Latchup Performance Exceeds 300 mA Pin for Pin Drop in for NC7SB3157 Tiny SC88 and WDFN6 Packages ESD Performance: Human Body Model; u 2000 V; Machine Model; u 200 V Extended Automotive Temperature Range -55C to +125C (See Appendix) Pb-Free Packages are Available SC-88 DF SUFFIX CASE 419B AF MG G FM G AF, F = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. FUNCTION TABLE Select Input L H Function B0 Connected to A B1 Connected to A ORDERING INFORMATION Device NLASB3157DFT2 NLASB3157DFT2G Package SC-88 Shipping 3000 Tape & Reel SC-88 3000 Tape & Reel (Pb-Free) WDFN6 3000 Tape & Reel (Pb-Free) NLASB3157MTR2G For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 1 November, 2006 - Rev. 9 Publication Order Number: NLASB3157/D NLASB3157 SC-88 B1 1 6 Select B1 VCC GND 2 3 1 WDFN6 6 5 4 Select VCC A GND 2 5 B0 3 4 A B0 (Top View) (Top View) Figure 1. Pin Assignment & Logic Diagram MAXIMUM RATINGS Rating Supply Voltage DC Switch Voltage (Note 1) DC Input Voltage (Note 1) DC Input Diode Current @ VIN t 0 V DC Output Current DC VCC or Ground Current Storage Temperature Range Junction Temperature Under Bias Junction Lead Temperature (Soldering, 10 Seconds) Power Dissipation @ +85C Symbol VCC VS VIN IIK IOUT ICC/IGND Tstg TJ TL PD Value -0.5 to +7.0 -0.5 to VCC + 0.5 -0.5 to + 7.0 -50 128 +100 -65 to +150 150 260 180 Unit V V V mA mA mA C C C mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. RECOMMENDED OPERATING CONDITIONS (Note 2) Characteristic Supply Voltage Operating Select Input Voltage Switch Input Voltage Output Voltage Operating Temperature Input Rise and Fall Time Control Input VCC = 2.3 V-3.6 V Control Input VCC = 4.5 V-5.5 V Thermal Resistance 2. Select input must be held HIGH or LOW, it must not float. Symbol VCC VIN VIN VOUT TA tr, tf 0 0 qJA - 10 5.0 350 C/W Min 1.65 0 0 0 -55 Max 5.5 VCC VCC VCC +125 Unit V V V V C ns/V http://onsemi.com 2 NLASB3157 DC ELECTRICAL CHARACTERISTICS VCC (V) 1.65-1.95 2.3-5.5 1.65-1.95 2.3-5.5 0 v VIN v 5.5 V 0 v A, B v VCC VIN = 0 V, IO = 30 mA VIN = 2.4 V, IO = -30 mA VIN = 4.5 V, IO = -30 mA VIN = 0 V, IO = 24 mA VIN = 3 V, IO = -24 mA VIN = 0 V, IO = 8 mA VIN = 2.3 V, IO = -8 mA VIN = 0 V, IO = 4 mA VIN = 1.65 V, IO = -4 mA ICC Quiescent Supply Current All Channels ON or OFF Analog Signal Range RRANGE On Resistance Over Signal Range (Note 3) (Note 7) IA = -30 mA, 0 v VBn v VCC IA = -24 mA, 0 v VBn v VCC IA = -8 mA, 0 v VBn v VCC IA = -4 mA, 0 v VBn v VCC IA = -30 mA, VBn = 3.15 IA = -24 mA, VBn = 2.1 IA = -8 mA, VBn = 1.6 IA = -4 mA, VBn = 1.15 IA = -30 mA, 0 v VBn v VCC IA = -24 mA, 0 v VBn v VCC IA = -8 mA, 0 v VBn v VCC IA = -4 mA, 0 v VBn v VCC VIN = VCC or GND IOUT = 0 VCC 4.5 3.0 2.3 1.65 4.5 3.0 2.3 1.65 5.0 3.3 2.5 1.8 0.15 0.2 0.5 0.5 6.0 12 28 125 0 VCC 0 VCC 25 50 100 300 W V W 0-5.5 1.65-5.5 4.5 "0.05 "0.05 3.0 5.0 7.0 4.0 10 5.0 13 6.5 17 1.0 "0.1 "0.1 TA = +255C Min Typ Max TA = -405C to +855C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC "1 "1 7.0 12 15 9.0 20 12 30 20 50 10 Max Unit V V mA mA W Symbol VIH VIL IIN IOFF RON Parameter HIGH Level Input Voltage LOW Level Input Voltage Input Leakage Current OFF State Leakage Current Switch On Resistance (Note 3) Test Conditions 3.0 2.3 1.65 5.5 W W W mA DRON On Resistance Match Between Channels (Note 3) (Note 4) (Note 5) On Resistance Flatness (Note 3) (Note 4) (Note 6) Rflat W 3. Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B Ports). 4. Parameter is characterized but not tested in production. 5. DRON = RON max - RON min measured at identical VCC, temperature and voltage levels. 6. Flatness is defined as the difference between the maximum and minimum value of On Resistance over the specified range of conditions. 7. Guaranteed by Design. http://onsemi.com 3 NLASB3157 AC ELECTRICAL CHARACTERISTICS VCC (V) 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 CL = 0.1 nF, VGEN = 0 V RGEN = 0 W RL = 50 W f = 10 MHz RL = 50 W f = 10 MHz RL = 50 W RL = 600 W 0.5 VP-P f = 600 Hz to 20 kHz 5.0 3.3 1.65-5.5 1.65-5.5 1.65-5.5 5.0 7.0 3.0 -57 -54 250 0.011 23 13 6.9 5.2 12.5 7.0 5.0 3.5 7.0 3.5 2.5 1.7 3.0 2.0 1.5 0.8 0.5 0.5 0.5 0.5 TA = +255C Min Typ Max TA = -405C to +855C Min Max 1.2 0.8 0.3 24 14 7.6 5.7 13 7.5 5.3 3.8 ns Unit ns Figure Number Figures 2, 3 Symbol tPHL tPLH Parameter Propagation Delay Bus to Bus (Note 9) Test Conditions VI = OPEN tPZL tPZH Output Enable Time Turn On Time (A to Bn) Output Disable Time Turn Off Time (A Port to B Port) Break Before Make Time (Note 8) VI = 2 VCC for tPZL VI = 0 V for tPZH Figures 2, 3 tPLZ tPHZ VI = 2 VCC for tPLZ VI = 0 V for tPHZ ns Figures 2, 3 tB-M ns Figure 4 Q OIRR Xtalk BW THD Charge Injection (Note 8) Off Isolation (Note 10) Crosstalk -3 dB Bandwidth Total Harmonic Distortion (Note 8) pC dB dB MHz % Figure 5 Figure 6 Figure 7 Figure 10 CAPACITANCE (Note 11) Symbol CIN CIO-B CIOA-ON Parameter Select Pin Input Capacitance B Port Off Capacitance A Port Capacitance when Switch is Enabled Test Conditions VCC = 0 V VCC = 5.0 V VCC = 5.0 V Typ 2.3 6.5 18.5 Max Unit pF pF pF Figure 8 Figure 9 Figure Number 8. Guaranteed by Design. 9. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). 10. Off Isolation = 20 log10 [VA/VBn]. 11. TA = +25C, f = 1 MHz, Capacitance is characterized but not tested in production. http://onsemi.com 4 NLASB3157 APPENDIX A DC ELECTRICAL EXTENDED AUTOMOTIVE TEMPERATURE RANGE CHARACTERISTICS VCC (V) 1.65-1.95 2.3-5.5 1.65-1.95 2.3-5.5 0 v VIN v 5.5 V 0 v A, B v VCC VIN = 0 V, IO = 30 mA VIN = 2.4 V, IO = -30 mA VIN = 4.5 V, IO = -30 mA VIN = 0 V, IO = 24 mA VIN = 3 V, IO = -24 mA VIN = 0 V, IO = 8 mA VIN = 2.3 V, IO = -8 mA VIN = 0 V, IO = 4 mA VIN = 1.65 V, IO = -4 mA ICC Quiescent Supply Current All Channels ON or OFF Analog Signal Range RRANGE On Resistance Over Signal Range (Note 12) (Note 14) IA = -30 mA, 0 v VBn v VCC IA = -24 mA, 0 v VBn v VCC IA = -8 mA, 0 v VBn v VCC IA = -4 mA, 0 v VBn v VCC VIN = VCC or GND IOUT = 0 VCC 4.5 3.0 2.3 1.65 0 VCC 0 VCC 25 50 100 300 V W 0-5.5 1.65-5.5 4.5 "0.05 "0.05 3.0 5.0 7.0 4.0 10 5.0 13 6.5 17 1.0 "0.1 "0.1 TA = +255C Min Typ Max TA = -555C to +1255C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC "1 "1 8.5 13.0 15.0 11 20 12 30 20 50 10 mA Max Unit V V mA mA W Symbol VIH VIL IIN IOFF RON Parameter HIGH Level Input Voltage LOW Level Input Voltage Input Leakage Current OFF State Leakage Current Switch On Resistance (Note 12) Test Conditions 3.0 2.3 1.65 5.5 12. Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the voltages on the two (A or B Ports). 13. Flatness is defined as the difference between the maximum and minimum value of On Resistance over the specified range of conditions. 14. Guaranteed by Design. * For DRON, RFLAT, Q, OIRR, Xtalk, BW, THD, and CIN see -405C to 855C section. http://onsemi.com 5 NLASB3157 APPENDIX A AC ELECTRICAL EXTENDED AUTOMOTIVE TEMPERATURE RANGE CHARACTERISTICS VCC (V) 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 1.65-1.95 2.3-2.7 3.0-3.6 4.5-5.5 23 13 6.9 5.2 12.5 7.0 5.0 3.5 7.0 3.5 2.5 1.7 3.0 2.0 1.5 0.8 0.5 0.5 0.5 0.5 TA = +255C Min Typ Max TA = -555C to +1255C Min Max 1.2 0.8 0.3 24 14 9.0 7.0 13 7.5 6.5 5.0 ns Unit ns Figure Number Figures 2, 3 Symbol tPHL tPLH Parameter Propagation Delay Bus to Bus (Note 16) Test Conditions VI = OPEN tPZL tPZH Output Enable Time Turn On Time (A to Bn) Output Disable Time Turn Off Time (A Port to B Port) Break Before Make Time (Note 15) VI = 2 VCC for tPZL VI = 0 V for tPZH Figures 2, 3 tPLZ tPHZ VI = 2 VCC for tPLZ VI = 0 V for tPHZ ns Figures 2, 3 tB-M ns Figure 4 15. Guaranteed by Design. 16. This parameter is guaranteed by design but not tested. The bus switch contributes no propagation delay other than the RC delay of the On Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance). * For DRON, RFLAT, Q, OIRR, Xtalk, BW, THD, and CIN see -405C to 855C section. http://onsemi.com 6 NLASB3157 AC LOADING AND WAVEFORMS VI RU NOTE: Input driven by 50 W source terminated in 50 W NOTE: CL includes load and stray capacitance NOTE: Input PRR = 1.0 MHz; tW = 500 ns FROM OUTPUT UNDER TEST CL RD Figure 2. AC Test Circuit tf = 2.5 ns tr = 2.5 ns SWITCH INPUT 10% tW tPLH OUTPUT tPHL VOH 50% 50% VOL OUTPUT 90% 50% 90% 50% 10% GND OUTPUT tPZH 50% tPHZ 50% tf = 2.5 ns VCC SELECT INPUT 10% tPZL tPLZ 90% 50% 90% 50% tr = 2.5 ns VCC 10% GND VTRI VOL + 0.3 V VOL VOH VOH - 0.3 V VTRI Figure 3. AC Waveforms VIN B0 B1 S A RL VOUT CL LOGIC INPUT VOUT tD 0.9 x VOUT LOGIC INPUT Figure 4. Break Before Make Interval Timing http://onsemi.com 7 NLASB3157 AC LOADING AND WAVEFORMS RGEN VGE BN S A RL 1 MW VOUT CL 100 pF LOGIC INPUT VOUT OFF ON OFF DVOUT LOGIC INPUT Q = (DVOUT)(CL) Figure 5. Charge Injection Test 10 nF VCC 50 W A S BN 50 W GND LOGIC INPUT 0 V or VIH Signal Generator 0 dBm 10 nF VCC B0 B1 S Analyzer 50 W GND A 50 W Analyzer Figure 6. Off Isolation Figure 7. Crosstalk 10 nF VCC A Capacitance Meter f = 1 MHz BN GND S LOGIC INPUT 0 V or VCC Capacitance Meter f = 1 MHz 10 nF VCC A S BN GND LOGIC INPUT 0 V or VCC Figure 8. Channel Off Capacitance Figure 9. Channel On Capacitance 10 nF Signal Generator 0 dBm VCC BN A 50 W S LOGIC INPUT 0 V or VCC GND Figure 10. Bandwidth http://onsemi.com 8 NLASB3157 PACKAGE DIMENSIONS SC-88/SOT-363/SC-70 DF SUFFIX CASE 419B-02 ISSUE W D e NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. 4 MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000 6 5 HE 1 2 3 -E- b 6 PL 0.2 (0.008) M E M DIM A A1 A3 b C D E e L HE A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 NLASB3157 PACKAGE DIMENSIONS WDFN6, 1.2x1.0x0.4P MT SUFFIX CASE 506AS-01 ISSUE A E A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D E e L L2 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C 0.10 C 7X 0.08 C L1 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative III III III A3 A1 4X D MOUNTING FOOTPRINT* A 6X 0.42 6X 0.22 C e 1 3 5X SEATING PLANE L 0.40 PITCH 1.07 DIMENSIONS: MILLIMETERS 6 4 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. b 6X BOTTOM VIEW 0.10 C A 0.05 C B NOTE 3 http://onsemi.com 10 NLASB3157/D |
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